Optical I/O Shines Intel’s OCI Chiplet Powers Next-Decade AI
The first-ever fully integrated optical computing interconnect (OCI) chiplet, co-packaged with an Intel CPU and executing real data
By enabling co-packaged optical input/output (I/O) in developing AI infrastructure for data centres and high performance computing (HPC) applications
This is the first OCI chiplet, intended to meet the increasing demands of AI infrastructure for greater bandwidth
Large language models (LLM) and generative AI are two recent advancements that are speeding up the global deployment of AI-based applications
Machine learning (ML) models that are larger and more effective will be essential in meeting the new demands of workloads involving AI acceleration
High bandwidth density and low power consumption are supported via electrical I/O, or copper trace connectivity
Optical I/O solutions such as Intel’s OCI chiplet could offer this kind of enhanced performance and energy efficiency to AI scalability
The OCI chiplet from Intel is a significant advancement in high-speed data transfer
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