SK Hynix's HPE Discover 2024 display features three product areas and a demonstration area demonstrating its AI memory solutions' potential
The industry-leading HBM3E, with its fast processing speed, capacity, and heat dissipation, is a critical product for AI systems' growing needs
In the AI age, CMM-DDR5 can boost system bandwidth by 50% and capacity by 100% compared to systems with only DDR5 DRAM
DDR5 RDIMMs can reach 6,400 Mbps using 1bnm, the fifth iteration of 10 nm manufacturing technology, whereas MCR DIMMs can reach 8,800 Mbps
A motherboard-bonded Multiplexer Combined Ranks Dual In-line Memory Module (MCR DIMM) combines two ranks of fundamental information processing units to improve speed
These include the PCle Gen5-based PS1010 and PS1030, whose quick sequential read speeds are said to make them perfect for AI, big data, and machine learning applications
The two discussed how their companies’ SSD devices are tailored for AI storage and contemporary data centre workloads throughout the discussion