Intel UCIe 2.0

Promote Open Chiplet Ecosystem with UCIe 2.0. The Universal Chiplet Interconnect Express is revolutionising on-package communication in chiplet technology

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chiplets can accelerate innovation and time to market in mobile, automotive, datacenter, and AI technologies

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This evolution tries to rethink system architecture beyond chip stacking

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UCIe 2.0 meets UCIe 1.0/1.1 criteria and is backwards compatible

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People who like pushing boundaries can use UCIe-3D for hybrid bonding and ultra-fine pitches

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UCIe 2.0 has revolutionised bandwidth density and power efficiency in 3D packaging. This progression rethinks system architecture beyond chip stacking. UCIe 2.0

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The UCIe specification covers the physical layer, protocol stack, software model, and compliance testing of the standardised Die-to-Die interface

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The UCIe 1.1 Specification improves the chiplet ecosystem by expanding use models and dependability approaches to additional protocols

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The UCIe 2.0 Specification covers testability, manageability, and debug (DFx) design issues for the SIP lifecycle over many chiplets For more details Govindhtech.com

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