Intel Unveiling the OCI Chiplet Co-packaged with CPU

They also intend to showcase their most recent Silicon Photonics Tx and Rx ICs

This trend has been accelerated by recent advances in generative AI and LLM

The development of larger and more effective Machine Learning (ML) models will be essential to meeting the growing demands of workloads involving AI acceleration

High bandwidth density and low power consumption are supported by electrical I/O, or copper trace connectivity

This first OCI implementation, which is a 4 Tbps bidirectional OCI Chiplet compatible with PCIe Gen5

One of their high-volume fabrication facilities in the United States produces these integrated Silicon Photonics chips

It demonstrates how Intel’s superior silicon, optical, packaging, and platform integration capabilities enable us to provide a comprehensive next-generation compute solution