MR-MUF Technology

Large part to HBM, the ultra-fast DRAM that keeps pushing the boundaries of memory technology, artificial intelligence has reached new heights

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HBM: A high-performance, high-value device that revolutionises data processing by connecting many DRAM chips via TSV

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SK Hynix's lengthy history of creating MR-MUF and TSV packaging technology explains its dominance

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SK Hynix Newsroom interviewed Gyujei Lee, Director of Package Product Development, on AI memory packaging technology

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Connecting electrodes that vertically penetrate the holes in the chip’s

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TSV was considered a next-generation memory technology that would surpass existing memory

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The new gadget from SK Hynix integrated WLP and TSV technologies

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The best graphics DRAM available at the time, GDDR5

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The corporation was developing MR-MUF technology as part of their technology strategy For more details govindhtech.com

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