parylene Dry Lift-Off

Researchers developed a parylene-based dry lift-off technique for high-resolution micropatterning of quantum dot (QD) films in optoelectronic devices

The process uses a parylene intermediate layer, applied by chemical vapor deposition, as a buffer for photolithographic patterning

Standard photolithography and plasma etching define the pattern on the parylene layer, which is then mechanically peeled off to remove unwanted QDs

The technique enables QDs to be deposited as the final step, maintaining their narrow emission linewidth and high photoluminescence

Achieved pattern resolutions are as fine as 1 µm, suitable for advanced micro-display and optoelectronic applications

Multi-color patterning is possible by repeating the process with different QD types, enabling integration of red and green QDs on a single substrate

The method was successfully integrated with blue GaN LED substrates, enabling high-resolution QD color converters for displays