Samsung Introduces CXL Memory Pooling

The world’s first FPGA based tiered memory solution for hypervisors

A new innovation in CXL and a compelling value-proposition with significant TCO benefits

Samsung demonstrated its CXL Memory Module DRAM (CMM-D) technology

Samsung provided 2024 Memcon guests with a demo of its most recent HBM3E 12H chip

using the company’s cutting-edge thermal compression non-conductive film (TC NCF) technology

HBM3E 12H improves both product yield and vertical density of the chip by more than 20% when compared to its predecessor

Samsung intends to begin mass manufacturing of the HBM3E 12H during the first half of this year