Samsung Introduces CXL Memory Pooling
The world’s first FPGA based tiered memory solution for hypervisors
A new innovation in CXL and a compelling value-proposition with significant TCO benefits
Samsung demonstrated its CXL Memory Module DRAM (CMM-D) technology
Samsung provided 2024 Memcon guests with a demo of its most recent HBM3E 12H chip
using the company’s cutting-edge thermal compression non-conductive film (TC NCF) technology
HBM3E 12H improves both product yield and vertical density of the chip by more than 20% when compared to its predecessor
Samsung intends to begin mass manufacturing of the HBM3E 12H during the first half of this year
Samsung’s revolutionary concepts and innovations inspire people all across the globe and help to build the future
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