Semiconductor GAA Process & 2.5D Packaging

Samsung Electronics will partner with a top Japanese AI startup to develop cutting-edge AI accelerator chips

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The company will provide turnkey semiconductor solutions with a 2nm GAA process and 2.5D packaging to preferred networks

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Samsung has successfully secured orders for the 2nm process with additional improvements in performance and power efficiency

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With this partnership with Preferred Networks, Japanese firms have achieved a first in the realm of large-scale heterogeneous integrated package technologies

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The chip was designed by GAONCHIPS, a specialized system semiconductor development business

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The company is a global AI leader after topping the Green500 supercomputer list three times in five years

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This strategic cooperation aims to push semiconductor application performance, efficiency, and scalability

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Samsung Electronics’ 2nm GAA process and 2.5D packaging technology advanced the semiconductor industry For more details govindhtech.com

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