This series covered the semiconductor back-end process, including semiconductor package types, packaging processes, and materials
Meanwhile, Semiconductor Packages device reliability is the probability that it will maintain its quality without failure over a set time, increasing customer satisfaction and repeat purchases
If a Semiconductor Packages company and its customers have different evaluation criteria, they must align their standards
In addition to international evaluation standards, many metrics assess product reliability. These include semiconductor product lifetime assessments
Product lifetime evaluations often use the high temperature operating life (HTOL) test. It evaluates temperature and voltage stress issues during product operation
Autoclave8 tests a plastic mold compound’s moisture resistance and mold structure reliability by infiltrating moisture with 100% relative humidity and high pressure
UHAST stresses thin substrate-type Semiconductor Packages like fine-pitch ball grid array (FBGA) packages like a PCT to assess reliability